Detailed Analysis of 16-Layer M6 HDI High-Speed PCBs with 2.0mm Thickness

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Introduction of High-Speed, Low-Loss Multi-layer Materials - Megtron6 (M6) R-5775

The Panasonic M6 laminate is a specialized multilayer copper-clad laminate (CCL) designed for high-frequency, high-speed, and high-reliability electronic devices. It is applicable in areas such as 5G communication, millimeter-wave radar, high-speed servers, and high-performance computing (HPC). Its core advantages include low dielectric loss (Df), stable dielectric constant (Dk), and excellent thermal reliability, making it suitable for stringent high-frequency signal transmission requirements.

Features

Dielectric Constant (DK): 3.4 at 1GHz/23°C, 3.34 at 13GHz
Dissipation Factor (Df): 0.002 at 1GHz/23°C, 0.0037 at 13GHz
Coefficient of Thermal Expansion (CTE): X-axis 16 ppm/°C, Y-axis 16 ppm/°C, Z-axis 45 ppm/°C
High Tg Value: >185°C (DSC method), 210°C (DMA method)
Thermal Decomposition Temperature (Td): 410°C (TGA method)
Multilayer PCB Design Support: 4 to 30 layers, adaptable to complex circuit requirements
Compliance: RoHS and halogen-free, meeting green manufacturing standards
Processing Compatibility: Compatible with traditional FR-4 processing technology, reducing production costs
Flammability Rating: UL 94V-0

Basic PCB Specifications

Specification	Details
Base Material	M6 (R5775G)
Layer Count	16 layers
Board Dimensions	110 mm x 110 mm (1 PCS), ± 0.15mm
Minimum Trace/Space	3/4 mils
Minimum Hole Size	0.2mm
Blind and Buried Vias	L1-L3, L6-L9, L14-L16
Finished Board Thickness	2.0mm
Finished Copper Weight	1oz (1.4 mils) outer layers, 0.5oz / 1oz inner layers
Via Plating Thickness	25 µm
Surface Finish	Electroless Nickel Immersion Gold (ENIG)
Top Silkscreen	White
Bottom Silkscreen	White
Top Solder Mask	Green
Bottom Solder Mask	Green
Via Filling	0.2mm vias filled and capped
Electrical Testing	100% electrical test prior to shipment

PCB Stack-Up (16-Layer Rigid PCB)

Layer	Material	Thickness
Copper Layer 1	Copper	35 µm
Prepreg	R-5670(G) 1080 X 1	85.1 µm
Copper Layer 2	Copper	17 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 3	Copper	17 µm
Prepreg	R-5670(G) 3313 X 1	99.4 µm
Copper Layer 4	Copper	17 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 5	Copper	17 µm
Prepreg	R-5670(G) 3313 X 1	99.4 µm
Copper Layer 6	Copper	17 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 7	Copper	35 µm
Prepreg	R-5670(G) 3313 X 1	99.4 µm
Copper Layer 8	Copper	35 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 9	Copper	17 µm
Prepreg	R-5670(G) 3313 X 1	99.4 µm
Copper Layer 10	Copper	17 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 11	Copper	17 µm
Prepreg	R-5670(G) 3313 X 1	99.4 µm
Copper Layer 12	Copper	17 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 13	Copper	17 µm
Prepreg	R-5670(G) 3313 X 1	99.4 µm
Copper Layer 14	Copper	17 µm
M6 Core	R5775G (HVLP)	96 µm
Copper Layer 15	Copper	17 µm
Prepreg	R-5670(G) 1080 X 1	85.1 µm
Copper Layer 16	Copper	35 µm

Impedance Control

Single-end: L1 11.8mil, 75Ω, reference layer 4
Single-end: L1 5.9mil, 50Ω, reference layer 2
Single-end: L16 5.9mil, 50Ω, reference layer 15
Differential: L1 5.9mil/7.87mil, 100Ω, reference layer 2
Differential: L10 3.94mil/5.9mil, 100Ω, reference layer 9
Differential: L12 3.94mil/5.9mil, 100Ω, reference layers 11 and 13

PCB Statistics:

Components: 154
Total Pads: 406
Through Hole Pads: 137
Top SMT Pads: 121
Bottom SMT Pads: 148
Vias: 532
Nets: 9

Artwork and Standards Information

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Typical Applications

5G Communication: Base stations, millimeter-wave antennas, RF front-ends of AAU (Active Antenna Unit)
Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver Assistance Systems)
Data Centers: High-speed server motherboards, 400G/800G optical module PCBs
Aerospace: High-frequency circuit boards for satellite communication and radar systems
Consumer Electronics: High-frequency Wi-Fi 6E/7 routers, AR/VR devices